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What's the Meaning Behind 10 Pairs Super Compact Profile Connection Module?
DESCRIPTIONS
10 pairs super compact profile connection module (TP-1325-10P), also called the M10 SC terminal block, is used throughout the distribution level, in the main distribution frame (MDF), in the cross connection cabinet (CCC) and in the distribution point (DP) boxes. It is highly reliable and cost-effective wire connection system for modern telecommunications and data networks.
It adopts IDC (Insulation Displacement Connection) technique, which means no soldering, wire-stripping or the use of screws, and which clamps the wires at a 45 degree angle, thus dramatically reducing the risk of a poor termination and increasing the wiring productivity. Contacts that ensure the highest degree of reliability even under the most adverse environmental and climatic conditions. A completely reliable, gas-tight connection between the contact and conductor.
LSA connection modules use a normally one-piece contact, thus only having the function of connection instead of disconnection performances. This module connects 10 individual pairs of copper wires using IDC technology in a compact, lightweight format. It is specifically engineered for installation on profile rods or high-density back mount frames, maximizing port availability in restricted cabinets or wall enclosures.
MAIN FEATURES
- Super Compact Design: The module features a significantly reduced footprint compared to traditional 10-pair modules, enabling higher density installations and saving valuable mounting space in cabinets or racks.
- Profile Mount Compatibility: Engineered to mount seamlessly on standard profile rods, it fits securely without requiring custom brackets or additional hardware.
- 10-Pair Termination Capacity: Provides connection for up to ten twisted pairs, making it suitable for subscriber distribution and internal cross-connects.
- IDC Connection System: Each pair is connected using industry-standard Insulation Displacement Contact terminals, allowing fast and reliable terminations without stripping wire insulation.
- High Density Wiring: The internal layout is optimized to reduce spacing between IDC points without compromising accessibility or insulation, allowing compact but effective wiring.
- Space-Saving Design: Compact profile enables efficient use of space in telecommunications and networking installations.
- Reliable Connectivity: Ensures secure and stable connections, minimizing signal loss and downtime.
- Durable Construction: Constructed with high-quality materials for long-lasting performance in demanding environments.
- Hassle-Free Deployment: Quick and hassle-free deployment process, saving time and resources during installation.
- Optimized Efficiency: Enhances efficiency and productivity in network installations by maximizing space utilization and streamlining connectivity solutions.
SCHEMATIC DIAGRAMS
ILLUSTRATION PICTURES
PACKING PICTURES
ORDER DATA
| Item No |
Descriptions |
| TP-1325-10P |
10 pairs super compact profile connection module |
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